High Purity Cryogenic Air Separation Unit For Electronics

High Purity Cryogenic Air Separation Unit For Electronics

A high purity cryogenic air separation unit for electronics supplies continuous 99.999%+ nitrogen, oxygen, or argon to semiconductor fabs, LED epitaxy, and PV cell lines. The unit operates 24/7 with no cycling. Outlet impurities are typically below 1 ppm total hydrocarbons and 0.5 ppm CO₂.
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Product Introduction

A high purity cryogenic air separation unit for electronics supplies continuous 99.999%+ nitrogen, oxygen, or argon to semiconductor fabs, LED epitaxy, and PV cell lines. The unit operates 24/7 with no cycling. Outlet impurities are typically below 1 ppm total hydrocarbons and 0.5 ppm CO₂.

 

Process Description

Ambient air is compressed, pre-cooled, and passed through a purification skid that removes water, CO₂, and hydrocarbons. The clean air then enters a cold box containing two distillation columns. Column operating temperature is between -185°C and -196°C. Separation occurs by repeated vaporization and condensation based on boiling points (N₂: -196°C, O₂: -183°C). The product gas is drawn from the top of the high-pressure column for nitrogen or from the low-pressure column for oxygen and argon.

 

Typical Performance Data

Parameter Range (at design conditions)
N₂ purity 99.999% – 99.9999%
N₂ flow rate 50 – 5,000 Nm³/h
O₂ purity 99.6% – 99.999%
Specific power (N₂) 0.38 – 0.45 kWh/Nm³
Delivery pressure 0.4 – 1.0 MPa(g)
Cold start time 6 – 8 hours
Hot restart from standby ~20 minutes

Values depend on site ambient temperature, cooling water conditions, and final purity requirement. Confirm with process simulation.

 

Power Consumption and Reliability Trade-off

For any high purity cryogenic air separation unit for electronics, specific power consumption is the largest operating cost. The design uses a high-efficiency turboexpander and staged distillation columns to keep power within the range shown above.

However, electronics fabs also face high interruption risk. A gas supply failure can scrap an entire wafer lot. Therefore, we typically recommend adding a liquid storage tank with vaporizer or a standby column. This increases capital cost but reduces production loss risk. Many clients accept the higher first cost after calculating their own downtime expense.

 

Technical Specifications

  • Separation method: Cryogenic rectification
  • Column material: Aluminum alloy 5083 or 304/316L stainless steel
  • Control system: PLC (Siemens or Rockwell) or DCS with Modbus TCP/IP remote access
  • Residual hydrocarbon in product: < 1 ppm
  • CO₂ after purification: < 0.5 ppm
  • Product dew point: < -70°C

 

Customization Options

Each site has different conditions. We adjust:

  • Design for high ambient temperature, humidity, or altitude
  • Purity grade (e.g., 99.9995% N₂ only - fewer column stages, lower power)
  • Full extraction configuration (N₂ + O₂ + Ar simultaneously)
  • Liquid backup system integration (tank + vaporizer + automatic changeover)
  • Containerized or skid-mounted layout for space-limited sites

We require site data (ambient conditions, required flow, purity, pressure) before proposing a final design.

 

Services and Certifications

  • Scope: Process design, fabrication, site installation, commissioning, operator training, ongoing maintenance support
  • Certifications: ISO 9001, ISO 14001, ASME or PED (if required), China pressure vessel license
  • References: Available under NDA. No customer names are shared without permission.

 

About Shenger Gas

Shenger Gas designs and builds the high purity cryogenic air separation unit for electronics based on actual site conditions, not pre-set brochures. We run a full process simulation for each project. Shop inspection includes helium leak test and cold performance check. On site, we commission until the product gas meets the spec for 72 consecutive hours. That is our handover standard. No claims without data.

 

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